Chip Packaging Engineering Manager

Minimum qualifications:

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
• 10 years of experience with package development for high volume production.
• 3 years of industry experience in engineering management.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
• Experience in the thermal and mechanical modeling of silicon packaging.
• Experience with the qualification process for advanced silicon packaging.
• Familiarity with general package assembly process, packaging materials, and reliability requirements (component and board level).
• Knowledge in 2.5D and 3D packaging technologies for high performance computing.

About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

We are looking for an experienced packaging engineering manager who has strong leadership and project management experience, is detail oriented, and operationally focused.

In this role, you will lead multi-disciplinary teams throughout custom silicon development with special focus on package bill of materials (BOMs) design tradeoffs, assembly process evaluation, mechanical reliability and qualification and silicon characterization. You will have a strong track record delivering products into production and experience in post silicon validation and qualification.Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible
The US base salary range for this full-time position is $227,000-$320,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google

Responsibilities

• Lead and manage a team developing high performance chip packages for Google TPUs.
• Provide technical mentorship on the thermal and mechanical aspects of package design.
• Drive advanced packaging solutions from concept to high volume production comprehending manufacturing, electrical, thermal and mechanical requirements.
• Drive collaboration with multi-functional internal teams, outsourced assembly and tests (OSATs) and material suppliers to deliver TPU chip package solutions for production.

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.