Mechanical Packaging Engineer - R0085807

Description

General Overview

As a Design Engineer I, you'll join Astemo’s global Mechanical Hardware team—an energetic, collaborative group responsible for the mechanical design of enclosures across various controller product lines, including Powertrain, Vehicle Dynamics, and AD/ADAS. This role focuses on developing durable mechanical packaging that can withstand thermal, chemical, vibration, shock, and fatigue-related challenges.

It’s a great opportunity for an early-career engineer looking to grow their skills in a fast-paced, cross-functional environment.

Key Responsibilities

• Design mechanical enclosures for automotive controllers, using materials and processes such as high-pressure die casting, stamping, and injection molding.
• Use CAD tools (preferably SolidWorks) to develop 3D models, assemblies, and 2D drawings.
• Create and maintain documentation including DFMEA, DVP&R, DRBFM, and other quality tools.
• Conduct or support mechanical, thermal, and vibration analysis (FEA/CFD).
• Support solder fatigue analysis using tools such as ANSYS Sherlock.
• Ensure manufacturability (DFM) approval from suppliers and internal product engineering teams.
• Maintain the mechanical bill of materials (BOM) and support test development for DV and PV phases.
• Represent Astemo in customer meetings and internal reviews.
• Ensure timely delivery of engineering deliverables in line with project milestones.
• Prepare and present technical reports and weekly updates to management.
• Conform to internal and customer design specifications and standards.
  
  

Qualifications

Required:

• Bachelor’s degree in Mechanical Engineering, Mechatronics, or a related field.
• 0–2 years of experience in mechanical design or engineering (internships and co-ops welcome).
• Familiarity with CAD software, ideally SolidWorks.
• Strong problem-solving skills and a foundation in mechanical design principles.
• Proficiency in Microsoft Office (Excel, PowerPoint, Word).
• Clear communication skills and the ability to work collaboratively across teams.
• Strong personal organization and time management.
  
  

Preferred

• Experience in electronics packaging, controller, or connector design.
• Exposure to high-pressure die casting, stamping, or injection molding processes.
• Background in thermal management and analysis.
• Familiarity with FEA and CFD tools (especially ANSYS Suite, Star-CCM+).
• Knowledge of GD&T and tolerance stack-up methods (statistical and arithmetic).
• Previous work with solder fatigue analysis (e.g., ANSYS Sherlock).
• Customer-facing or supplier coordination experience.
• Comfort working in multicultural and global teams.
  
  

Additional Details

Supervisory Responsibilities: None

Location: Harrodsburg, KY or Farmington Hills, MI (Hybrid – minimum 3 days onsite per week)

Physical Requirements

Must be able to perform light physical tasks and occasionally lift items up to 75 pounds.

Travel

Domestic and international travel may be required occasionally based on project needs.

Note: Job level and responsibilities may vary depending on organizational size, experience, and individual capabilities.