Micro Assembly Process Engineer
FormFactor Inc.
Date: 1 week ago
City: Livermore, CA
Contract type: Full time
Position: Micro Assembly Process Engineer
Duties: Process and develop equipment for automatization assembly and semiconductor testing devices. Perform medium to complex functions associated with probe card manufacturing operations, including various aspects of process development/CPI Continuous Process Improvement, and update and create work instructions and associated operator training and certification. Drive systematically equipment related activities, included but not limited to: Equipment development, spare parts management, and equipment performance indicators analysis and improvement (i.e., MTTR, MTBF, MTTA) Measure System Assurance and capability improvements. Systematize processes by providing mainline build support for NCR dispositions and various NPI activities, and follow-up with VDF maintenance to enable overall bandwidth. Perform functions associated with all probe card manufacturing and operations, including direct material part flows. Support engineering activities by recognizing and prioritizing improvement opportunities, pioneering new ideas, and finding innovative methods to accomplish production goals. Modify automated assembly processes and parameters to comply with new products requirements. Build first article probe cards including the next processes: mechanical substrates alignment/assembly, initial set-up and verification, assurance of metrology systems and re-work procedures if required. Lead assembly equipment upgrades based on process quality and throughput improvements. Manage capacity models to establish human or equipment needs to drive product ramps and assure that team’s performance is adequate to meet capacity needs.
Education Required: Bachelor’s degree or foreign equivalent in Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, or related field.
Experience Required: 5 years of progressive experience as Manufacturing Engineer or related occupation.
Special Requirements: Must have at least 3 years of prior work experience in each of the following:
Duties: Process and develop equipment for automatization assembly and semiconductor testing devices. Perform medium to complex functions associated with probe card manufacturing operations, including various aspects of process development/CPI Continuous Process Improvement, and update and create work instructions and associated operator training and certification. Drive systematically equipment related activities, included but not limited to: Equipment development, spare parts management, and equipment performance indicators analysis and improvement (i.e., MTTR, MTBF, MTTA) Measure System Assurance and capability improvements. Systematize processes by providing mainline build support for NCR dispositions and various NPI activities, and follow-up with VDF maintenance to enable overall bandwidth. Perform functions associated with all probe card manufacturing and operations, including direct material part flows. Support engineering activities by recognizing and prioritizing improvement opportunities, pioneering new ideas, and finding innovative methods to accomplish production goals. Modify automated assembly processes and parameters to comply with new products requirements. Build first article probe cards including the next processes: mechanical substrates alignment/assembly, initial set-up and verification, assurance of metrology systems and re-work procedures if required. Lead assembly equipment upgrades based on process quality and throughput improvements. Manage capacity models to establish human or equipment needs to drive product ramps and assure that team’s performance is adequate to meet capacity needs.
Education Required: Bachelor’s degree or foreign equivalent in Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, or related field.
Experience Required: 5 years of progressive experience as Manufacturing Engineer or related occupation.
Special Requirements: Must have at least 3 years of prior work experience in each of the following:
- Using statistical program software to manage medium to complex analysis models in JMP and Minitab, including process data, yield analysis, and DOEs.
- Six Sigma and lean manufacturing tools and techniques.
- Surface finish manufacturing processes including grinding, polishing, and lapping with tight tolerances.
- NPI (new product introduction) processes and equipment assessment and customization.
- Micro assembly process and equipment performance CPI (continuous process improvement) to lead improvement projects.
- Using microscopes, micromanipulators, and metrology tools.
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