FEA Engineer
Qualcomm
Date: 3 weeks ago
City: Santa Clara, CA
Contract type: Full time

Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Systems Engineering
General Summary:
Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!
Our Mission
We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.
Position: FEA Engineer
As an experienced FEA Engineer (individual contributor), you will play a pivotal role within the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, thermal, mechanical, and component suppliers. You will be responsible for structural modeling, testing, and characterization of advanced server processors and high-performance computing systems from die to system level.
Key Responsibilities
Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.
OR
PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay Range and Other Compensation & Benefits:
$192,600.00 - $330,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
3069212
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Systems Engineering
General Summary:
Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!
Our Mission
We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.
Position: FEA Engineer
As an experienced FEA Engineer (individual contributor), you will play a pivotal role within the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, thermal, mechanical, and component suppliers. You will be responsible for structural modeling, testing, and characterization of advanced server processors and high-performance computing systems from die to system level.
Key Responsibilities
- Perform advanced numerical modeling to analyze and optimize the reliability and manufacturability of server packages and system designs.
- Support the mechanical design of packages and systems from initial concept through detailed design and manufacturing readiness.
- Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, reliability, and cost requirements.
- Conduct measurements and experiments to validate models, continuously enhancing their accuracy and robustness.
- Develop and maintain documentation, guidelines, and tools to support the design process and project success.
- Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.
- Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field.
- 6+ years of hands-on experience in FEA modeling within the high-tech industry.
- Proficiency in major FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or equivalent).
- Experience in FEA modeling for microelectronics packaging, interconnects, sockets, BGAs, and board/system level.
- Ability to interpret complex numerical simulation results through fundamental engineering principles.
- Understanding of semiconductor processing, packaging techniques, materials, and server design considerations.
- Familiarity with reliability modeling for sockets, BGAs, and microelectronics packaging.
- Experience in designing and executing validation tests to verify analytical models and calibrate results with empirical data.
- Proven ability to work independently and collaboratively within a cross-functional team environment.
- Strong technical documentation skills and excellent written and verbal communication.
- Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field.
- 10+ years of hands-on experience in FEA modeling within the high-tech industry.
- Expertise in structural FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or similar).
- Extensive experience in holistic structural analysis of die/package/BGA/socket/system structures.
- Solid understanding of advanced packaging and interconnect reliability modeling at the board/system level, with knowledge of microelectronics reliability testing and methodologies.
- Understanding of OCP product designs and industry best practices.
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.
Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.
OR
PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay Range and Other Compensation & Benefits:
$192,600.00 - $330,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
3069212
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